Key Applications
- Hyperscale / Hyperconverged
- HPC and Big Data
- Data Center Enterprise Applications
- Scale Out Storage
- Telco Data Center
- Virtualization Server
Key Features 8 Hot-pluggable System Nodes in a 4U form factor. Each node supports:1. Single AMD EPYC™ 7003/7002 Series Processor (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)2. Up to 2TB ECC 3DS LRDIMM,
up to DDR4-3200MHz; 8 DIMM slots3. Expansion slots: 1 PCI-E 4.0 x16 (LP Riser),
1 PCI-E 4.0 x16 (for AIOM)4. AIOM Network card,
1 dedicated IPMI LAN port5. 1 VGA, 2 USB 3.0 ports6. 6 Hot-swap 2.5" drive bays:
2 NVMe/SATA3,
4 SATA3 (optional NVMe with additional cables) M.2 Interface: 4 SATA/PCI-E 4.0 x4 M.2 Form Factor: 2242, 2260, 2280, 22110 M.2 Key: M-Key7. 3x 4cm 17.6K RPM middle fans8. 2200W Redundant Power Supplies Titanium Level (96%) (Full redundancy based on
configuration and application load)
Complete System Only: To maintain quality and integrity, this product is sold only as a completely assembled system (for optimal performance 8 DIMMs is recommended). Minimum requirement is 1 CPU, 4 DIMMs, 1 HDD/NVMe and 1 AIOM/AOC NIC card per node.
Single AMD EPYC™ 7003/7002 Series Processor (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
Socket SP3
Supports CPU TDP / cTDP up to 280W*
Cores
Up to 64 Cores
Note
* Certain CPUs with high TDP may be supported only under specific conditions. Please contact Supermicro Technical Support for additional information about specialized system optimization
System Memory
(per Node)
Memory Capacity
8 DIMM slots
Supports up to 2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
Information in this document is subject to change without notice. Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.
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