H8SME-F
Supermicro, Inc.

   
  A+ Products   Motherboards   [ H8SME-F ]
H8SME-F
Key Features
1. Single AMD Opteron™ 3000 series
    processor (Socket AM3+)
    8/4-Core ready; HT3.0 Link
2. AMD SR5650 / SP5100 Chipset
3. Up to 32GB VLP DDR3 1600MHz Unb.
    ECC/non-ECC; 4x DIMM sockets
4. 4x SATA2 (3.0 Gbps) ports via
    AMD SP5100 Controller; RAID 0, 1, 10
5. 1 Micro LP PCI-E 2.0 x8 slot
6. Integrated Matrox G200eW Graphics
7. Integrated IPMI 2.0 with Dedicated LAN

 
Links & Resources
Tested Memory List
Tested HDD List
Motherboard Manual
Update Your BIOS
IPMI Firmware
Download the Latest Drivers and Utilities
Download Driver CD
OS Compatibility

   

Product SKUs - Discontinued SKU (EOL). Please contact sales-rep for alternative options.
MBD-H8SME-F
  • H8SME-F (Bull Pack)
 
Physical Stats
Form Factor
  • Proprietary
Dimensions
  • 4.6" x 11.7" (29.72cm x 11.68cm)
 
Processor/Chipset
CPU
  • Single 942-pin Socket AM3+
  • Supports up to Single 8/4-Core ready AMD Opteron™ 3000 Series processor
  • HT3.0 Link support
Chipset
  • AMD chipset SR5650 / SP5100
 
System Memory
Memory Capacity
  • Supports up to 32GB Unbuffered ECC/non-ECC VLP DDR3 1600/1333/1066 SDRAM in 4 DIMMs
  • Single or Dual (recommended) channel memory
Memory Type
  • VLP DDR3 1600/1333/1066MHz un-buffered ECC / non-ECC SDRAM 72-bit, 240-pin gold-plated DIMMs
DIMM Sizes
  • 8GB, 4GB, 2GB, 1GB
Memory Voltage
  • 1.5V, 1.35V
 
On-Board Devices
SATA
  • AMD SP5100 RAID 0, 1, 10
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM over LAN support
  • Winbond® WPCM450 BMC
VGA
  • Matrox G200eW 16MB DDR2 graphics
Super I/O
  • Winbond® W83527HG chip
 
Input / Output
SATA
  • 4x SATA2.0 (3Gb/s) Ports
USB
  • 2x USB 2.0 via KVM connector
VGA
  • VGA port via KVM connector
Serial Ports
  • 1 Fast UART 16550 serial port via KVM connector
IPMI
  • 1x dedicated IPMI LAN port
 
Expansion Slots
PCI-Express
  • 1 Micro LP PCI-E 2.0 x8 slot
 
System BIOS
BIOS Type
  • 16Mb SPI Flash ROM with AMI® BIOS
BIOS Features
  • Plug and Play (PnP)
  • DMI 2.3
  • PCI 2.2
  • ACPI 2.0
  • USB Keyboard Support
  • SMBIOS 2.3
 
Management
Software
Power Configurations
  • ACPI Power Management
  • Keyboard Wakeup from Soft-Off
  • Power-on mode control for AC power loss recovery
 
PC Health Monitoring
CPU
  • Monitors CPU Core Voltages, +1.8V, +3.3V, +5V, ±12V, +3.3V Standby, -12V Standby, VBAT, HT, memory, chipset
  • CPU switching voltage regulator
Temperature
  • Monitoring for CPU and chassis environment
  • CPU Thermal Trip Support
  • Thermal control for 9x fan connectors
  • I2C Temperature Sensing Logic
LED
  • CPU / System Overheat LED
  • +5V Standby Alert LED
 
Operating Environment / Compliance
RoHS

RoHS 6/6
Environmental Specifications
  • Operating Temperature:
       10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)
 
OS Compatibility
• Please see our OS Compatibility Chart
 
Regulatory
FCC
  • Passed to meet FCC standard requirement
Bull Pack
  Part Number Qty Description
H8SME-F MBD-H8SME-F -O 1 H8SME-F Motherboard

** It is recommended to use dedicated LAN for KVM-over-LAN with fast speed needed.
Information in this document is subject to change without notice.
Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.
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AMD, AMD Motherboard, AMD Opteron, Opteron 1000, Opteron, Socket AM2