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SuperServer®
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  MicroBlade


 




 

Supermicro Solutions based on Intel® Xeon® Scalable Processors


SuperServer®
Motherboard
SuperBlade®
Chassis
| Mainstream | WIO | DCO | GPU | Storage | Workstation | Twin | FatTwin | Ultra | Embedded |


  Serverboards SKUs - Display  |  All  |  UP  |  DP  |  MP  | or Socket P (E5) / H4 (E3)  |



  Supermicro Serverboards

Supermicro's new generation X11 DP and UP serverboards offer the highest levels of performance, efficiency, security and scalability in the industry with up to: 3TB DDR4 2666MHz in 24 DIMM slots per node, 7 PCI-E slots, SAS 3.0/SATA 3.0/NVMe hot-swap HDD/SSD support, 10GBase-T/10G SFP+/56Gbps FDR InfiniBand networking options, SATA Disk-on-Module (DOM), and IPMI 2.0 plus KVM with dedicated LAN. The SuperWorkstation boards offer in addition 7.1 HD Audio, and up to 11 USB ports.

The Supermicro X11 DP and UP Serverboards and SuperWorkstation boards support the Intel® Xeon® Scalable processors for exceptional performance. They are offered in a variety of form factors, including ATX, E. ATX, E.E. ATX, and several proprietary versions supporting the broadest array of market segments:

  • Data Center Optimized (DCO)
  • Application Optimized
  • Resource Optimized
  • I/O Optimized (WIO)
  • Twin
  • TwinPro™
  • FatTwin™
  • GPU/Coprocessor
  • SuperWorkstation
  • SuperStorage
  • SuperBlade®
  • MicroBlade
  • MicroCloud
  • Embedded

With these New Generation X11 Serverboard and SuperWorkstation Platforms, Supermicro offers the most extensive range of computing solutions for Data Center, Enterprise, Cloud, HPC, Hadoop/Big Data, Storage, and Embedded environments.




Workstation

X11DAi-N
• Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
• Intel® C621 chipset
• 16 DIMMs, up to 2TB 3DS ECC LRDIMM, up to DDR4-2666MHz
• 4 PCI-E 3.0 x16 and 2 PCI-E 3.0 x8; M.2 Interface: PCI-E 3.0 x4
• 2 PCI-E 3.0 NVMExpress x4 Internal Ports
• 2 Gigabit Ethernet LAN ports
• IPMI 2.0 and KVM with dedicated LAN
• 1 VGA, TPM Header, 7.1 HD Audio, 1 COM (header),
   Thunderbolt header
• 2 USB 3.1 (1 Type A, 1 Type C rear),
   7 USB 3.0 (4 rear, 2 front header, 1 Type A)
• 2 SuperDOM (Disk on Module) ports
• Form factor: E-ATX, 12" x 13"
 


7 PCI-E 3.0 slots

X11DPH-T / X11DPH-i
• Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
• Intel® C622 chipset (X11DPH-i); Intel® C624 chipset (X11DPH-T)
• 16 DIMMs, up to 2TB 3DS ECC LRDIMM, up to DDR4-2666MHz
• 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
• M.2 Interface: PCI-E 3.0 x4; supports up to 22110
• 2x 1GbE LAN ports via Marvell® 88E1512 (X11DPH-i)
• 2x 10GBase-T LAN ports via Intel® X557 (X11DPH-T)
• IPMI 2.0 and KVM with dedicated LAN
• 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
• 7 USB 3.0 (4 rear, 2 via headers, 1 Type A)
• 2 SuperDOM (Disk on Module) ports
• Form factor: E-ATX, 12" x 13"
 


Intel Quick Assist Technology

X11DPH-TQ (coming soon)
• Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
• Intel® C628 chipset
• 16 DIMMs, up to 2TB 3DS ECC LRDIMM, up to DDR4-2666MHz
• 3 PCI-E 3.0 x16, 3 PCI-E 3.0 x8, slot 1 can be used with optional SLM
• M.2 Interface: PCI-E 3.0 x4; support up to 22110
• 2x 10GBase-T LAN ports via Intel® X557
• IPMI 2.0 and KVM with dedicated LAN
• 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
• 7 USB 3.0 (4 rear, 2 via headers, 1 Type A)
• 2 SuperDOM (Disk on Module) ports
• Form factor: E-ATX, 12" x 13"
 


NVMe port option
3 AOC in 1U
SAS3 AOM support

X11DDW-NT / X11DDW-L
• Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
• Intel® C622 chipset (X11DDW-NT); Intel® C621 chipset (X11DDW-L)
• 12 DIMMs, up to 1.5TB 3DS ECC LRDIMM, up to DDR4-2666MHz
• 1 PCI-E 3.0 x32 Left riser slot, 1 PCI-E 3.0 x16 Right riser slot,
   1 PCI-E 3.0 x16 for AOM; M.2 Interface: PCI-E 3.0 x4
• 4 PCI-E 3.0 NVMExpress x4 Internal Ports (X11DDW-NT)
• 2x 10GBase-T LAN ports via Intel® C622 (X11DDW-NT)
• 2x 1GbE LAN ports, 1 dedicated LAN for IPMI 2.0
• 1 VGA, 1 COM (header), TPM 2.0 Header
• 6 USB 3.0 ports (4 rear + 2 via headers)
• 2 SuperDOM (Disk on Module) ports
• Form factor: Proprietary WIO, 12.3" x 13.4"
 


For Server SKU only
FatTwin™

X11DPFR-SN / X11DPFR-S
• Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
• Intel® C621 chipset
• 12 DIMMs, up to 1.5TB 3DS ECC LRDIMM, up to DDR4-2666MHz
• 1 PCI-E 3.0 x16 Left riser slot, 1 PCI-E 3.0 x16 Right riser slot,
   1 PCI-E 3.0 x16 for AOM; M.2 Interface: PCI-E 3.0 x4
   1 PCI-E 3.0 x16 SIOM slot for flexible networking options
• 4 PCI-E 3.0 NVMExpress x4 Internal Ports (X11DPFR-SN)
• 1 VGA, TPM 2.0 Header
• 2 USB 3.0 ports (rear)
• 2 SuperDOM (Disk on Module) ports
• Form factor: Proprietary FatTwin, 6.8" x 19.46"
 


For Server SKU only
TwinPro™

X11DPT-PS
• Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
• Intel® C621 chipset
• 16 DIMMs, up to 2TB 3DS ECC LRDIMM, up to DDR4-2666MHz
• 1 PCI-E 3.0 x24 Left riser slot, 1 PCI-E 3.0 x16 Right riser slot,
   1 PCI-E 3.0 x16 and 1 PCI-E 3.0 x8 for AOM
   1 PCI-E 3.0 x16 SIOM slot for flexible networking options
• 1 VGA, TPM 2.0 Header
• 2 USB 3.0 ports (rear)
• Form factor: Proprietary, 8.54" x 18.72"

 


For Server SKU only
BigTwin™

X11DPT-B
• Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
• Intel® C621 chipset
• 24 DIMMs, up to 3TB 3DS ECC LRDIMM, up to DDR4-2666MHz
• 1 PCI-E 3.0 x16 Left riser slot, 1 PCI-E 3.0 x16 Right riser slot,
   1 PCI-E 3.0 x24 Left riser slot, and 1 PCI-E 3.0 x8 for AOM
   1 PCI-E 3.0 x16 SIOM slot for flexible networking options
• 1 VGA, TPM 2.0 Header
• 2 USB 3.0 ports (rear)
• Form factor: Proprietary, 7.61" x 18.86"

 


For Server SKU Only
Ultra, up to 24 DIMMs
Flexible Networking

X11DPU / X11DPU-X / X11DPU-XLL / X11DPU-Z+ (coming soon)
• Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
• Intel® C621 chipset
• Up to 24 DIMMs, up to 3TB 3DS ECC LRDIMM, up to DDR4-2666MHz
• Riser card support:
   1 PCI-E 3.0 x32 Right Riser Slot or
   1 PCI-E 3.0 x8 Right Riser Slot + 1 PCI-E 3.0 x40 Ultra Riser Slot
• 4 PCI-E 3.0 NVMExpress x4 Internal Ports
• Flexible network via Ultra Riser Cards
• IPMI 2.0 and KVM with dedicated LAN
• Up to 14 SATA3 ports via C621; RAID 0, 1, 5, 10
• 2 VGA D-Sub, TPM 2.0 Header, 1 COM
• 3 USB 3.0 (2 rear, 1 Type A)
• 2 SuperDOM (Disk on Module) ports
• Form factor: Proprietary Ultra/WIO, 17" x 17"
 


GPU

X11DPG-QT
• Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
• Intel® C621 chipset
• 16 DIMMs, up to 2TB 3DS ECC LRDIMM, up to DDR4-2666MHz
• 6 PCI-E 3.0 x16 slots, 1 PCI-E 3.0 x4 (in x8 slot)
• 2x 10GBase-T LAN ports via Intel® X550
• IPMI 2.0 and KVM with dedicated LAN
• 10 SATA3 (6Gbps) ports via C621
• 7.1 HD Audio header, TPM 2.0 Header, 2 COM ports (1 rear, 1 header)
• 5 USB 3.0 (2 rear, 2 via header, 1 Type A),
   4 USB 2.0 ports (2 rear, 2 via header)
• 2 SuperDOM (Disk on Module) ports
• Form factor: Proprietary, 15.12" x 13.2"
 


Mainstream

X11DPi-NT / X11DPi-N
• Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
• Intel® C621 (X11DPi-N) / C622 (X11DPi-NT) chipset
• 16 DIMMs, up to 2TB 3DS ECC LRDIMM, up to DDR4-2666MHz
• 4 PCI-E 3.0 x16 slots, 2 PCI-E 3.0 x8 slots
• 2 PCI-E 3.0 NVMExpress x4 Internal Ports
• M.2 Interface: PCI-E 3.0 x4; support 2260, 2280, 22110
• 2x 10GBase-T LAN ports (X11DPi-NT)
• 2x 1GbE LAN ports (X11DPi-N)
• 5 USB 3.0 (2 rear, 2 via header, 1 Type A),
   4 USB 2.0 ports (2 rear, 2 headers)
• 2 SuperDOM (Disk on Module) ports
• Form factor: E-ATX, 12" x 13"
 


DCO

X11DPL-I
• Dual Socket P (LGA 3647): Intel® Xeon® Scalable processors
• Intel® C621 chipset
• 8 DIMMs, up to 1TB 3DS ECC LRDIMM, up to DDR4-2666MHz
• 2 PCI-E 3.0 x16 slots, 3 PCI-E 3.0 x8 slots, 1 PCI-E 3.0 x4 (in x8) slot
• M.2 Interface: PCI-E 3.0 x4; support 2260, 2280
• 2x 1GbE LAN ports via Marvell® 88E1512
• 1 VGA, TPM 2.0 Header, 1 COM port (header)
• 3 USB 3.0 (2 via header, 1 Type A),
   4 USB 2.0 ports (2 rear, 2 via header)
• 2 SuperDOM (Disk on Module) ports
• Form factor: ATX, 12" x 10"
 


Mainstream

X11SPi-TF
• Single Socket P (LGA 3647): Intel® Xeon® Scalable processors
• Intel® C622 chipset
• 8 DIMMs, up to 1TB 3DS ECC LRDIMM, up to DDR4-2666MHz
• 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x16 (x16 or x8), 1 PCI-E 3.0 x8 (x0 or x8),
   1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8 slot)
• M.2 Interface: PCI-E 3.0 x4 and SATA; support 2280, 22110
• 2x 10GBase-T LAN ports via Intel® X557
• IPMI 2.0 and KVM with dedicated LAN
• 10 SATA3 (6Gbps) ports via C622
• TPM Header, 2 COM ports (1 rear, 1 header)
• 5 USB 3.0 (2 rear, 2 via header, 1 Type A)
   6 USB 2.0 ports (2 rear, 4 via headers)
• 2 SuperDOM (Disk on Module) ports
• Form factor: ATX, 12" x 9.6"
 


WIO

X11SPW-CTF / X11SPW-TF
• Single Socket P (LGA 3647): Intel® Xeon® Scalable processors
• Intel® C622 chipset
• 6 DIMMs, up to 768GB 3DS ECC LRDIMM, up to DDR4-2666MHz
• 1 PCI-E 3.0 x8 (in x16 slot), 1 PCI-E 3.0 x32 Left Riser Slot
• M.2 Interface: PCI-E 3.0 x4 and SATA; support 2280, 22110
• 2x 10GBase-T LAN ports via Intel® X557
• IPMI 2.0 and KVM with dedicated LAN
• 10 SATA3 (6Gbps) ports via C622
• 4 SAS3 (12Gbps) ports via Broadcom 3008 (X11SPW-CTF)
• 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
• 5 USB 3.0 (2 rear, 2 via header, 1 Type A)
   7 USB 2.0 ports (2 rear, 5 via headers)
• 2 SuperDOM (Disk on Module) ports
• Form factor: Proprietary WIO, 8.15" x 13.05"
 


Embedded

X11SPM-TPF / X11SPM-TF / X11SPM-F
• Single Socket P (LGA 3647): Intel® Xeon® Scalable processors
• Intel® C622 (X11SPM-TPF, X11SPM-TF) / C621 (X11SPM-F) chipset
• 6 DIMMs, up to 768GB 3DS ECC LRDIMM, up to DDR4-2666MHz
• 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8
• M.2 Interface: PCI-E 3.0 x4; support 2242, 2280
• 2x 10G SFP+ ports via Inphi CS4227 (X11SPM-TPF)
• 2x 10GBase-T LAN ports via Intel® X557 (X11SPM-TF)
• 2x 1GbE LAN ports via Marvell® 88E1512 (X11SPM-F)
• IPMI 2.0 and KVM with dedicated LAN
• 12 SATA3 (6Gbps) ports via C622/C621
• 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
• 5 USB 3.0 (2 rear, 2 via header, 1 Type A)
   6 USB 2.0 ports (2 rear, 4 via headers)
• 2 SuperDOM (Disk on Module) ports
• Form factor: Micro ATX, 9.6" x 9.6"
 


Cost Optimized Storage

X11SPH-nCTPF / X11SPH-nCTF
• Single Socket P (LGA 3647): Intel® Xeon® Scalable processors
• Intel® C622 chipset
• 8 DIMMs, up to 1TB 3DS ECC LRDIMM, up to DDR4-2666MHz
• 1 PCI-E 3.0 x16 (x16 or x8), 1 PCI-E 3.0 x8 (x0 or x8),
   1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8 slot)
• 2 PCI-E 3.0 NVMExpress x4 Internal Ports
• M.2 Interface: PCI-E 3.0 x4 and SATA
• 2x 10G SFP+ ports via Inphi CS4227 (X11SPH-nCTPF)
• 2x 10GBase-T LAN ports via Intel® X557 (X11SPH-nCTF)
• IPMI 2.0 and KVM with dedicated LAN
• 10 SATA3 (6Gbps) ports via C622
• 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
• 5 USB 3.0 (2 rear, 2 via header, 1 Type A)
   8 USB 2.0 ports (2 rear, 6 via headers)
• 2 SuperDOM (Disk on Module) ports
• Form factor: ATX, 12" x 9.6"
 


I/O Intensive

X11SPL-F
• Single Socket P (LGA 3647): Intel® Xeon® Scalable processors
• Intel® C621 chipset
• 8 DIMMs, up to 1TB 3DS ECC LRDIMM, up to DDR4-2666MHz
• 2 PCI-E 3.0 x8 (in x16 slot), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8 slot)
• M.2 Interface: PCI-E 3.0 x4 and SATA; support 2280, 22110
• 2x 1GbE LAN ports via Intel® i210
• IPMI 2.0 and KVM with dedicated LAN
• 8 SATA3 (6Gbps) ports via C621
• 1 VGA, TPM Header, 2 COM ports (1 rear, 1 header)
• 5 USB 3.0 (2 rear, 2 via header, 1 Type A)
   8 USB 2.0 ports (2 rear, 6 via headers)
• 2 SuperDOM (Disk on Module) ports
• Form factor: ATX, 12" x 9.6"
 


GPU

X11SPG-TF
• Single Socket P (LGA 3647): Intel® Xeon® Scalable processors
• Intel® C621 chipset
• 6 DIMMs, up to 768GB 3DS ECC LRDIMM, up to DDR4-2666MHz
• 1 PCI-E 3.0 x16 Center Right slot, 1 PCI-E 3.0 x16 Left Riser slot,
   1 PCI-E 3.0 x16 Right Riser Slot
• M.2 Interface: PCI-E 3.0 x4 and SATA
• 2x 10GBase-T LAN ports via Intel® X550
• IPMI 2.0 and KVM with dedicated LAN
• 6 SATA3 (6Gbps) ports via C621
• 1 VGA, TPM Header, 1 COM (header)
• 5 USB 3.0 (2 rear, 2 via header, 1 Type A)
   4 USB 2.0 ports (2 rear, 2 via header)
• 2 SuperDOM (Disk on Module) ports
• Form factor: Proprietary, 7.71" x 16.64"
 


MP, 4-Way

X11QPH+
• Quad Socket P (LGA 3647): Intel® Xeon® Scalable processors
• Intel® C621 chipset
• 48 DIMMs, up to 6TB 3DS ECC LRDIMM, up to DDR4-2666MHz
• 1 PCI-E 3.0 x32 (rear left), 1 PCI-E 3.0 x40 (rear right), 1 PCI-E 3.0
   x8 (in x16, rear middle), 1 PCI-E 3.0 (x32 for 2U or x48 + x8
   for 4U) on front for NVME/Internal card support. 1 PCIe 3.0
   (x32 for 2U or x48 for 4U) on front for NVME/Internal card support
• 8 NVMExpress; M.2 Interface: PCI-E 3.0 x2
• 4x 1GbE LAN ports via Intel® i350
• IPMI 2.0 and KVM with dedicated LAN
• 20 SAS3 ports, 12 SATA3 (6Gbps) ports
• 1 VGA, 1 TPM Header, 1 COM (rear), 2 USB 3.0 (rear)
• 2 SuperDOM (Disk on Module) ports
• Form factor: Proprietary, 16.8" x 20.5"
 



Solution Families:

  • SuperServer®
  • Ultra / Ultra Low-Latency
  • BigTwin™ / TwinPro™
  • FatTwin™
  • Data Center Optimized
  • WIO Optimized
  • GPU/Coprocessor™
  • Mainstream
  • SuperStorage
  • SuperWorkstation
  • Embedded / Max I/O

  • SuperBlade®
  • Motherboard
  • X11 Optimized Chassis


New Generation of
Computing Excellence:

  • 28 Cores CPU; 45-205W TDP
  • UPI up to 10.4 GT/s
  • 6 Memory channels
    Up to DDR4-2666MHz
  • New 3D memory support
  • Widened PCI-E lanes to 48
  • NVMe support
  • SuperDOM support
  • Intel Quick Assist Technology
  • TPM Security Module support
  • Titanium Level (96%+) PSU

New Generation of Computing Excellence
Titanium Level 96% Efficiency


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